cpm-028

Unit : mm

The probe comprises various components, each chosen for its unique properties and functionality. The top plunger is made of SK4, a high-carbon tool steel known for its strength and durability. It is further enhanced with an Au plating, which improves conductivity and protects against corrosion. The bottom plunger is made of Be Cu (Beryllium Copper) and is also Au plated, ensuring excellent electrical contact and long-term reliability. The barrel is made of P.B. (Phosphor Bronze) and is Au plated, providing optimal conductivity and protection against oxidation. The spring, made of SUS (Stainless Steel), is also Au plated, offering durability and resistance to corrosion.

In terms of mechanical specifications, the probe exerts a spring force of 20 grams at 0.65mm. This force ensures reliable and consistent contact with the semiconductor device being tested, facilitating accurate measurements. The full travel distance of the probe is 1.0mm, indicating the maximum displacement it can achieve during testing. The recommended travel distance is 0.65mm, representing the optimal operating range for precise and reliable testing.

The probe is designed to withstand rigorous testing conditions, with a mechanical life of 200K cycles. This extended lifespan ensures the probe's longevity and reliability throughout multiple testing operations.

In terms of electrical specifications, the probe has a current rating of 1A, indicating its ability to handle a higher current without compromising performance. The contact resistance is measured to be less than 100mΩ, which represents the impedance of the probe's electrical contact. This low contact resistance ensures minimal signal loss and accurate measurements during semiconductor testing.

The probe also demonstrates impressive bandwidth performance, with a measured -0.105dB attenuation at 20GHz. This characteristic ensures minimal signal loss and accurate measurements, particularly in high-frequency testing scenarios.